glass metal hybride package from China manufacturer - Xi'an Taijin Industrial Electrochemical Technology Co., LTD.

Place of Origin:

Shaanxi, China (Mainland)


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Product Detail

The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components

It is generally used if it is not possible to protect the component to be en capsulated using standard packaging, due to a special number or arrangement of feedthroughs.

Product Advantages

1) Effective hermetic sealing

2) Long-term efficacy

3) High reliability

Technology Specifications

All microelectronic packages are produced according to customer specifications, since there are no general standards governing their manufacture. The types of glass and metal used, as well as the types of electroplating, can be adapted to customer requirements.

Applications

· Data communication

· Microwave packaging

· Industrial lasers

· Medical technology

· Sensor technology

· Power electronics