product name :
Optoelectronic glass-to-metal seal product
The core objective of our Opto-Electronics Product Division is to offer long-lasting protection for opto-electronic components, which at the same time allows for the safe transmission of optical signals.
1TO'S HEADERS
Product Description
A TO package always consists of two components: a header and a cap. The TO header provides a mechanical basis for the installation of electronic and optical components such as semiconductors, laser diodes or simple electronic circuits, while at the same time providing power to the encapsulated components with the aid of pins.
Product Advantages
We are experienced in the production of TO headers in all conventional, standard designs and sizes,such as TO-45,TO-56,TO-5,TO-3,TO-8,TO66,TO-38,TO-39 and so on.
Technology Specifications
The types of metal used in the manufacture of TO headers depend largely on the production methods used. Compression glass seals are generally manufactured using cold rolled steel (i.e. AISI 1010), while matched seals are primarily manufactured using Kovar (ASTM-F15) and Alloy 52 (ASTM-F30).
The TO headers can be plated with various materials (nickel, nickel-gold, nickel-silver), and can also be coated in additional metal layers when required.
2. HYBRID/MICRO-ELECTRONIC
Product Description
The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. It is generally used if it is not possible to protect the component to be en capsulated using standard packaging, due to a special number or arrangement of feedthroughs.
Product Advantages
1) Effective hermetic sealing
2) Long-term efficacy
3) High reliability
Technology Specifications
All microelectronic packages are produced according to customer specifications, since there are no general standards governing their manufacture. The types of glass and metal used, as well as the types of electroplating, can be adapted to customer requirements.
Applications
- Datacommunication
- Microwavepackaging
- Industriallasers
- Medicaltechnology
- Sensortechnology
- Powerelectronics
